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  1 power f-mos fets unit: mm 2SK1605 silicon n-channel power f-mos fet n features l high avalanche energy capacity l v gss : 30v guaranteed l low r ds(on) , high-speed switching characteristic n applications l high-speed switching (switching power supply) l for high-frequency power amplification n absolute maximum ratings (t c = 25c) parameter drain to source breakdown voltage gate to source voltage drain current avalanche energy capacity allowable power dissipation channel temperature storage temperature symbol v dss v gss i d i dp eas * p d t ch t stg ratings 450 30 5 10 100 50 2 150 - 55 to +150 unit v v a a mj w c c n electrical characteristics (t c = 25c) parameter drain to source cut-off current gate to source leakage current drain to source breakdown voltage avalanche energy capacity gate threshold voltage drain to source on-resistance forward transfer admittance input capacitance (common source) output capacitance (common source) reverse transfer capacitance (common source) turn-on time fall time turn-off time (delay time) symbol i dss i gss v dss eas * v th r ds(on) | y fs | c iss c oss c rss t on t f t d(off) conditions v ds = 360v, v gs = 0 v gs = 30v, v ds = 0 i d = 1ma, v gs = 0 l = 8mh, i d = 5a, v dd = 50v v ds = 25v, i d = 1ma v gs = 10v, i d = 3a v ds = 25v, i d = 3a v ds = 20v, v gs = 0, f = 1mhz v gs = 10v, i d = 3a v dd = 150v, r l = 50 w min 450 100 1 2 typ 1 3.2 700 100 40 70 35 80 max 0.1 1 5 1.3 unit ma m a v mj v w s pf pf pf ns ns ns * single pulse * avalanche energy capacity test circuit dc pulse t c = 25c ta = 25c 10.00.2 5.50.2 7.50.2 16.70.3 0.70.1 14.00.5 solder dip 4.0 0.5 +0.2 C0.1 1.40.1 1.30.2 0.80.1 2.540.25 5.080.5 2 13 2.70.2 4.20.2 4.20.2 f 3.10.1 1: gate 2: drain 3: source eiaj: sc-67 to-220 full pack package (a) v ds i d l d rain gate s ource r gs c v dd pvs maintenance/ discontinued maintenance/discontinued includes following four product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type please visit following url about latest information. http://www.semicon.panasonic.co.jp/en/
2 power f-mos fets 2SK1605 i d ? v ds | y fs | ? i d r ds(on) ? i d i d ? v gs c iss , c oss , c rss ? v ds t on , t f , t d(off) ? i d p d ? ta area of safe operation (aso) eas ? t j 0 102030405060 0 1 2 3 4 5 6 7 8 5v 4.5v 5.5v 6v v gs =15v 10v 8v t c =25?c drain to source voltage v ds ( v ) drain current i d ( a ) 012 10 8 26 4 0 1 2 3 4 5 6 v ds =25v t c =25?c drain current i d ( a ) forward transfer admittance |y fs | ( s ) 012 10 8 26 4 0 1 2 3 4 5 v gs =10v t c =25?c drain current i d ( a ) drain to source on-resistance r ds(on) ( w ) 012 10 8 26 4 0 12 10 8 6 4 2 v ds =25v t c =25v gate to source voltage v gs ( v ) drain current i d ( a ) 0 40 80 120 160 200 240 10 30 100 300 1000 3000 10000 c iss c oss c rss f=1mhz t c =25?c drain to source voltage v ds ( v ) input capacitance ( common source ) , output capacitance ( common source ) , reverse transfer capacitance ( common source ) c iss ,c oss ,c rss ( pf ) 012 10 8 26 4 0 20 40 60 80 100 120 t d(off) t f t on v dd =150v v gs =10v t c =25?c drain current i d ( a ) switching time t on ,t f ,t d(off) ( ns ) 020 40 60 80 100 120 140 160 0 10 20 30 40 50 60 (1) t c =ta (2) without heat sink (p d =2w) (1) (2) ambient temperature ta ( ?c ) allowable power dissipation p d ( w ) 1 10 100 1000 3 30 300 0.01 0.1 1 10 100 0.03 0.3 3 30 non repetitive pulse t c =25?c i dp t=1ms dc 10ms i d gate to source voltage v gs ( v ) drain current i d ( a ) 25 50 75 100 125 150 175 0 20 40 60 80 100 120 i d =5a v dd =50v junction temperature t j ( ?c ) avalanche energy capacity eas ( mj ) maintenance/ discontinued maintenance/discontinued includes following four product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type please visit following url about latest information. http://www.semicon.panasonic.co.jp/en/
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd. maintenance/ discontinued maintenance/discontinued includes following four product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type please visit following url about latest information. http://www.semicon.panasonic.co.jp/en/


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